Process Engineer – Network Switches & AI Servers

About the role

We are seeking a senior Process Engineer to lead the manufacturing flow for our high‑speed network switches and AI servers. Based in Bac Ninh, you will work directly with contract manufacturers while collaborating daily with electrical, mechanical, signal‑integrity, thermal, test and quality teams at headquarters.

Key responsibilities

• Develop and own the end‑to‑end SMT and PCBA processes for complex, high‑density boards, including stencil design, paste selection, SPI deposition, component placement and reflow profiling.
• Optimize reflow for large BGAs (2 000‑7 000 balls), FCBGA, LGA and OAM packages, managing warpage, head‑in‑pillow, voiding and solder‑joint reliability.
• Drive mixed‑technology assembly such as press‑fit connectors, fine‑pitch QFN, 0201/01005 passives and high‑pin‑count optical cages (QSFP‑DD, OSFP, OSFP‑XD).
• Lead DFM/DFA reviews with design teams before tape‑out and ensure manufacturability of the board.
• Own mechanical box‑build and chassis assembly, including heatsink and cold‑plate installation, torque specifications, gasketing, EMI/RFI shielding and cable routing.
• Integrate liquid‑cooling solutions, perform leak and dry‑break testing, and define related fixtures and tooling.
• Provide on‑line support at the factory, including night‑time troubleshooting of reflow profiles and rework operations.

Required profile

• Senior‑level engineer with extensive hands‑on experience in SMT and mechanical assembly for high‑performance electronics.
• Strong analytical mindset and the ability to ask critical questions across silicon packaging, signal integrity, thermal and optics domains.
• Willingness to work directly on the production line, including off‑hours support when needed.
• Excellent collaboration skills with cross‑functional teams and external manufacturing partners.

Required skills

• Surface Mount Technology (SMT) and PCB Assembly (PCBA)
• Stencil design, solder paste selection, SPI deposition, component placement
• Reflow profile development and optimization for large BGAs, FCBGA, LGA, OAM packages
• Automated Optical Inspection (AOI), X‑ray inspection, rework processes
• Mixed‑technology assembly (press‑fit, fine‑pitch QFN, 0201/01005 passives)
• High‑pin‑count optical cage integration (QSFP‑DD, OSFP, OSFP‑XD)
• Design for Manufacturing / Assembly (DFM/DFA)
• Mechanical box‑build, chassis assembly, torque and fastener strategy, EMI/RFI shielding
• Liquid‑cooling integration, cold‑plate and manifold installation, leak testing
• Fixture and tooling design, GD&T